Computer and Mobile/Accessories/Accessories
Cooling paste
≥1.63W/m-k | White
Features
• Suitable to be applied to CPU, UPS, inverter, chipset and other PC components
• Low thermal resistance, high conductivity for heat transfer
This Nedis cooling paste is very heat conductive. It fills in all those microscopic imperfections on the heatsink and CPU/GPU that can trap air in them and cause a loss in the heatsink’s performance. The cooling paste ensures an outstanding heat conduction and dissipation. This allows you to run heavy programs without the motherboard getting overheated.
Packaging
Package contents
Cooling paste syringe
Application spatula
Retail package dimensions Giftbox with eurolock
Width | Height | Length |
---|---|---|
80 mm | 140 mm | 20 mm |
Logistic dimensions
Packed per | Width | Height | Length | Weight |
---|---|---|---|---|
1 | 25 mm | 145 mm | 85 mm | 23 g |
20 | 175 mm | 165 mm | 225 mm | 493 g |
40 | 240 mm | 195 mm | 360 mm | 1460 g |
Product specifications
Width |
20 mm |
Height |
133 mm |
Depth |
10 mm |
Weight |
5 g |
Colour |
White |
Moment beared temperature |
-50-340 °C |
Type |
Paste |
Specific gravity |
≥2 |
Thermal conductivity |
≥1.63W/m-k |
Thermal impedance |
≤0.249 °C-in²/W |
Thixotropic index |
350 ± 10 |
Viscosity |
1000 |
Number of Products in Package |
1 pcs |
Operating temperature range |
-30 - 300 °C |